AUSTIN, TX, Accelsius, whose proprietary two-phase, direct-to-chip liquid cooling systems enable high-performance computing and rack density for data center and edge operators, announced the successful raise of $24 million pursuant to a Series A funding round.
Accelsius, whose proprietary two-phase, direct-to-chip liquid cooling systems enable high-performance computing and rack density for data center and edge operators, announced the successful raise of $24 million pursuant to a Series A funding round. The Series A funding round started in early 2024.
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By VC News Daily
Source: VC News Daily
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